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W25X16, W25X16A, W25X32, W25X64
14.2 8-Pin SOIC 208-mil (Package Code SS)
SYMBOL
MILLIMETERS
MIN MAX
INCHES
MIN MAX
A
A1
A2
b
C
D
E
E1
1.75
0.05
1.70
0.35
0.19
5.18
7.70
5.18
2.16
0.25
1.91
0.48
0.25
5.38
8.10
5.38
0.069
0.002
0.067
0.014
0.007
0.204
0.303
0.204
0.085
0.010
0.075
0.019
0.010
0.212
0.319
0.212
e
1.27 BSC
0.050 BSC
L
θ
y
0.50
0 o
---
0.80
8 o
0.10
0.020
0 o
---
0.031
8 o
0.004
Notes:
1. Controlling dimensions: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the
package.
4. Formed leads shall be planar with respect to one another within .0004 inches at the seating plane.
Publication Release Date: may 5, 2008
- 41 -
Revision I
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